XiO Photonics capabilities include optical chip design, Fiber-chip coupling (VIS-NIR) and Chip-chip coupling. Together with PCB design and manufacturing and electronic design and manufacturing, XiO Photonics has strong capabilities in the total Photonic Integrated module package design and manufacturing. Our capabilities are offered as assembly service for third party photonic components for prototype or small series production.

XiO Photonics B.V.

PO Box 1254
7500BG Enschede
The Netherlands

© 2013 - XiO Photonics B.V.